pradeepmvp

hi all mistake proofing is the method of avoding mistake to happen in my previous assignment, i have some problem with temperature maintenance of chip manufacturing. i experieced some characteristic abnormality in fucntioning of multilayer ceramic chip capacitor that i needed to prove and submit my report i was handed a machine completely for a week and at each temperature i produced batch of chips and proceeded until to the end of the process. (the problem i observed is the malfucntion of thermostats.) The experimented batch of chips with abnormal temperature having 5% of the abnormality as same as in mass production. i recommonded to change design of thermostats and heating unit. after change i analysed the product. The abnormality reduced from 1% to 0.05 %. with regards Pradeep

Good day sir, This is Pradeep from GB group 7 Feb batch. During my tenure in Singapore, I am an incharge of cleanroom process . The process is to stack 200 sheets (3 micron sheet on one base). It was found that there is some stack shift of 50 microns for every 8 stacks. The critical X's were temperature of the base, parallism (spec < 10 microns ) between base and sheet carrying head and the Sheet thickness. The last two were corrected and found ok. But still the occurance of one out of 35 could be seen. The set point was 50 deg C. When base temperature reduced to 40 deg, the stack shift was observed ( same machine) at the same rate of occurance during production. Hence the mistake proofing was done. It also been observed that the bonding strength between sheet was low upto 40 Deg C and kept on increased to 70 Deg C then stabilized. So recommonded and implement 70 Deg for all material and machines ensuring no quality problem. The reduction in defective reflected for a cost down of S $10 K per month. Hope I could answer for mistake proofing. With regards Pradeep