A medical devices company, developing technology to enable smaller medical devices, launched a substrate development effort as part of a larger-scale technology and product development effort. The substrate development effort involved predicting the stress caused by the laser welding process to ensure product reliability.
In this Design for Six Sigma (DFSS) case study, design and analysis of computer experiments (DACE) was applied to risks associated with laser welding in an electronic welding process on a substrate. This process, DACE, was selected so that computer simulations could be used to predict the stresses and warp of the specimen with varying factor levels. Rather than creating eight different samples, all work was able to be simulated with a computer, saving time and money.